Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9984993 | Bonding structure for semiconductor package and method of manufacturing the same | Min Shu, Yi-Hsiu Tseng, Kuan-Neng Chen | 2018-05-29 |
| 9496238 | Sloped bonding structure for semiconductor package | Min Shu, Yi-Hsiu Tseng, Kuan-Neng Chen | 2016-11-15 |