Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9496221 | Method for forming fuse pad and bond pad of integrated circuit | Tai-I Yang, Chih-Hao Lin, Hong-Seng Shue, Ruei-Hung Jang | 2016-11-15 | $3,361,000 |
| 6797983 | Method of fabrication LCOS structure | Ralph Chen, Yuan-Li Tsai, Ching-Chun Huang, Sheng-Hsiung Yang | 2004-09-28 | $1,484,000 |
| 6624079 | Method for forming high resistance resistor with integrated high voltage device process | Yuan-Li Tsai, Ralph Chen, Heng-Chun Kao, Ching-Chun Hwang | 2003-09-23 | $3,500,000 |