Issued Patents All Time
Showing 51–64 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9117825 | Substrate pad structure | Hao-Juin Liu, Chita Chuang, Ming Hung Tseng, Chen-Shien Chen | 2015-08-25 |
| 9093440 | Connector structures of integrated circuits | Shang-Yun Tu, Ming Hung Tseng, Chen-Cheng Kuo, Chen-Shien Chen | 2015-07-28 |
| 9053990 | Bump interconnection techniques | Chita Chuang, Yu-Chen Hsu, Ming Hung Tseng, Chen-Shien Chen | 2015-06-09 |
| 8883628 | Electrical connection structure | Chang-Chia Huang, Tsung-Shu Lin, Chen-Cheng Kuo, Chen-Shien Chen | 2014-11-11 |
| 8847387 | Robust joint structure for flip-chip bonding | Ching-Wen Hsiao, Chen-Shien Chen, Chen-Cheng Kuo, Ru-Ying Huang | 2014-09-30 |
| 8829673 | Bonded structures for package and substrate | Ming-Hong Cha, Chita Chuang, Hao-Juin Liu, Tsung-Hsien Chiang, Chen-Cheng Kuo +1 more | 2014-09-09 |
| 8772950 | Methods and apparatus for flip chip substrate with guard rings outside of a die attach region | Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2014-07-08 |
| 8729699 | Connector structures of integrated circuits | Shang-Yun Tu, Ming Hung Tseng, Chen-Cheng Kuo, Chen-Shien Chen | 2014-05-20 |
| 8659123 | Metal pad structures in dies | Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2014-02-25 |
| 8476759 | Electrical connection structure | Chang-Chia Huang, Tsung-Shu Lin, Chen-Cheng Kuo, Chen-Shien Chen | 2013-07-02 |
| 8299616 | T-shaped post for semiconductor devices | Chen-Cheng Kuo, Ching-Wen Hsiao, Chen-Shien Chen | 2012-10-30 |
| 8241963 | Recessed pillar structure | Wen-Wei Shen, Chen-Shien Chen, Ming-Fa Chen | 2012-08-14 |
| 8232643 | Lead free solder interconnections for integrated circuits | Ching-Wen Hsiao, Chen-Cheng Kuo, Chen-Shien Chen | 2012-07-31 |
| 8227924 | Substrate stand-offs for semiconductor devices | Cheng Hung Shen, Tin-Hao Kuo, Chen-Cheng Kuo, Chen-Shien Chen | 2012-07-24 |