Issued Patents All Time
Showing 26–50 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10748785 | Substrate pad structure | Hao-Juin Liu, Chita Chuang, Ming Hung Tseng, Chen-Shien Chen | 2020-08-18 |
| 10692848 | Stress reduction apparatus and method | Yu-Chen Hsu, Hao-Chun Liu, Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2020-06-23 |
| 10515917 | Bump on pad (BOP) bonding structure in semiconductor packaged device | Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2019-12-24 |
| 10468366 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Tsung-Hsien Chiang, Hao-Juin Liu +1 more | 2019-11-05 |
| 10163839 | Bump on pad (BOP) bonding structure in semiconductor packaged device | Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2018-12-25 |
| 10056345 | Conical-shaped or tier-shaped pillar connections | Tin-Hao Kuo, Chen-Shien Chen, Mirng-Ji Lii, Chen-Hua Yu, Sheng-Yu Wu | 2018-08-21 |
| 9991218 | Connector structures of integrated circuits | Shang-Yun Tu, Ming Hung Tseng, Chen-Cheng Kuo, Chen-Shien Chen | 2018-06-05 |
| 9905524 | Bump structures in semiconductor device and packaging assembly | Chita Chuang, Tsung-Shu Lin, Chen-Cheng Kuo, Chen-Shien Chen | 2018-02-27 |
| 9881885 | Metal routing architecture for integrated circuits | Chen-Cheng Kuo, Chita Chuang, Chih-Hua Chen, Chen-Shien Chen | 2018-01-30 |
| 9786621 | Elongated bump structures in package structure | Chita Chuang, Chen-Shien Chen, Ming Hung Tseng | 2017-10-10 |
| 9748188 | Method of forming a bump on pad (BOP) bonding structure in a semiconductor packaged device | Chen-Cheng Kuo, Chita Chuang, Chen-Shien Chen | 2017-08-29 |
| 9741589 | Substrate pad structure | Hao-Juin Liu, Chita Chuang, Ming Hung Tseng, Chen-Shien Chen | 2017-08-22 |
| 9673125 | Interconnection structure | Hao-Juin Liu, Chita Chuang, Yu-Jen Tseng, Chen-Shien Chen | 2017-06-06 |
| 9673161 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Tsung-Hsien Chiang, Hao-Juin Liu +1 more | 2017-06-06 |
| 9659903 | Method of manufacturing connector structures of integrated circuits | Shang-Yun Tu, Ming Hung Tseng, Chen-Cheng Kuo, Chen-Shien Chen | 2017-05-23 |
| 9472521 | Scheme for connector site spacing and resulting structures | Chita Chuang, Hao-Juin Liu, Chen-Cheng Kuo, Chen-Shien Chen | 2016-10-18 |
| 9425136 | Conical-shaped or tier-shaped pillar connections | Tin-Hao Kuo, Chen-Shien Chen, Mirng-Ji Lii, Chen-Hua Yu, Sheng-Yu Wu | 2016-08-23 |
| 9397059 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Tsung-Hsien Chiang, Hao-Juin Liu +1 more | 2016-07-19 |
| 9373598 | Connector structures of integrated circuits | Shang-Yun Tu, Ming Hung Tseng, Chen-Cheng Kuo, Chen-Shien Chen | 2016-06-21 |
| 9257412 | Stress reduction apparatus | Yu-Chen Hsu, Hao-Juin Liu, Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2016-02-09 |
| 9224688 | Metal routing architecture for integrated circuits | Chita Chuang, Chih-Hua Chen, Chen-Cheng Kuo, Chen-Shien Chen | 2015-12-29 |
| 9196573 | Bump on pad (BOP) bonding structure | Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2015-11-24 |
| 9159695 | Elongated bump structures in package structure | Chita Chuang, Ming Hung Tseng, Chen-Shien Chen | 2015-10-13 |
| 9142500 | Apparatus for lead free solder interconnections for integrated circuits | Ching-Wen Hsiao, Chen-Cheng Kuo, Chen-Shien Chen | 2015-09-22 |
| 9123788 | Bonded structures for package and substrate | Ming-Hong Cha, Chita Chuang, Hao-Juin Liu, Tsung-Hsien Chiang, Chen-Cheng Kuo +1 more | 2015-09-01 |