Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068300 | Chip-on-wafer-on-substrate package with improved yield | Chia-Wei Chang, Jyun-Lin Wu, Yao-Chun Chuang | 2024-08-20 |
| 10879098 | Semiconductor chip holder | Tsung-Jen Liao, Pei-Haw Tsao, Tsui-Mei Chen, Yu-Jung LIN, Sean Xuan Lin | 2020-12-29 |