Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159847 | Integrated fan-out structures and methods for forming the same | Tsui-Mei Chen, Li-Huan Chu, Pei-Haw Tsao | 2024-12-03 |
| 11527499 | Integrated fan-out structures and methods for forming the same | Tsui-Mei Chen, Li-Huan Chu, Pei-Haw Tsao | 2022-12-13 |
| 11164763 | Carrier tape system and methods of using carrier tape system | Pei-Haw Tsao, Tsui-Mei Chen | 2021-11-02 |
| 11164764 | Carrier tape system and methods of using carrier tape system | Pei-Haw Tsao, Tsui-Mei Chen | 2021-11-02 |
| 10879098 | Semiconductor chip holder | Pei-Haw Tsao, Tsui-Mei Chen, Yu-Jung LIN, Ju-Min Chen, Sean Xuan Lin | 2020-12-29 |
| 10679877 | Carrier tape system and methods of using carrier tape system | Pei-Haw Tsao, Tsui-Mei Chen | 2020-06-09 |
| 9576820 | Semiconductor structure and method of manufacturing the same | — | 2017-02-21 |
| 9437542 | Chip package structure | — | 2016-09-06 |
| 9269643 | Chip package structure | — | 2016-02-23 |
| 9196553 | Semiconductor package structure and manufacturing method thereof | Mei-Fang Peng, Cheng-Tang Huang | 2015-11-24 |
| 9190324 | Manufacturing method for micro bump structure | — | 2015-11-17 |
| 9123684 | Chip package structure and manufacturing method thereof | — | 2015-09-01 |
| 9087912 | Method for wafer level packaging and a package structure thereof | — | 2015-07-21 |
| 9018772 | Chip structure and multi-chip stack package | — | 2015-04-28 |
| 8980695 | Manufacturing method of wafer level package | — | 2015-03-17 |
| 8836144 | Wafer level package structure | — | 2014-09-16 |
| 8240882 | Light emitting diode module and method for making the same | Chung-Kai Wang, Yuan-Hsin Liu, Yao-Tsung Hsu | 2012-08-14 |
| 8154029 | Planar light source device | Yen-Cheng Chen, Ching-Lin Tseng, Ming-Li Chang, Cheng-Tai Chou | 2012-04-10 |