Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9196553 | Semiconductor package structure and manufacturing method thereof | Tsung-Jen Liao, Mei-Fang Peng | 2015-11-24 |
| 8319337 | Conductive structure for a semiconductor integrated circuit and method for forming the same | Chung-Pang Chi | 2012-11-27 |
| 8274150 | Chip bump structure and method for forming the same | — | 2012-09-25 |
| 8211789 | Manufacturing method of a bump structure having a reinforcement member | — | 2012-07-03 |
| 7969003 | Bump structure having a reinforcement member | — | 2011-06-28 |
| 7888172 | Chip stacked structure and the forming method | — | 2011-02-15 |
| 7879651 | Packaging conductive structure and method for forming the same | — | 2011-02-01 |
| 7656020 | Packaging conductive structure for a semiconductor substrate having a metallic layer | — | 2010-02-02 |