Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354975 | Guard ring structure | Yao-Chun Chuang, Cheng-Chien Li, Ching-Pin Lin | 2025-07-08 |
| 12288735 | Through via structure | Yao-Chun Chuang, Cheng-Chien Li, Ching-Pin Lin | 2025-04-29 |
| 12265119 | Repackaging IC chip for fault identification | Chien-Yi Chen, Kao-Chih Liu, Chia-Hong Lin, Yu-Ting Lin | 2025-04-01 |
| 12046566 | Devices with through silicon vias, guard rings and methods of making the same | Yao-Chun Chuang, Ching-Pin Lin, Cheng-Chien Li | 2024-07-23 |
| 9929070 | Isolation rings for packages and the method of forming the same | Chih-Horng Chang, Tin-Hao Kuo, Tsung-Fu Tsai | 2018-03-27 |
| 9548245 | Isolation rings for packages and the method of forming the same | Chih-Horng Chang, Tin-Hao Kuo, Tsung-Fu Tsai | 2017-01-17 |
| 9048333 | Isolation rings for packages and the method of forming the same | Chih-Horng Chang, Tin-Hao Kuo, Tsung-Fu Tsai | 2015-06-02 |
| 8710681 | Isolation rings for blocking the interface between package components and the respective molding compound | Chih-Horng Chang, Tin-Hao Kuo, Tsung-Fu Tsai | 2014-04-29 |
| 8581399 | Metal bump structure | Tsung-Fu Tsai, Yian-Liang Kuo | 2013-11-12 |