Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12265119 | Repackaging IC chip for fault identification | Chien-Yi Chen, Chia-Hong Lin, Yu-Ting Lin, Min-Feng Ku | 2025-04-01 |
| 12219709 | Forming trench in IC chip through multiple trench formation and deposition processes | Wenmin Hsu, Yu-Ting Lin, Chia-Hong Lin, ChienYi Chen | 2025-02-04 |