Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12432852 | Circuit board structure with embedded ceramic substrate and manufacturing process thereof | Yu-Hsien LIAO, SHIH-HAN WU, JHIH-WEI LAI, MING-YEN PAN | 2025-09-30 |
| 8766734 | Through silicon via-based oscillator wafer-level-package structure and method for fabricating the same | Chi-Chung Chang, Chih-Hung Chiu, Yen-Chi Chen, Kuan-Neng Chen | 2014-07-01 |