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JHIH-WEI LAI

TI Tong Hsing Electronic Industries: 1 patents #19 of 38Top 50%
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Patent #TitleCo-InventorsDate
12432852 Circuit board structure with embedded ceramic substrate and manufacturing process thereof Yu-Hsien LIAO, SHIH-HAN WU, JIAN-YU SHIH, MING-YEN PAN 2025-09-30