Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11990437 | System and method for forming solder bumps | Eric P. Lewandowski, Jae-Woong Nah, Jeng-Bang Yau | 2024-05-21 |
| 10879202 | System and method for forming solder bumps | Eric P. Lewandowski, Jae-Woong Nah, Jeng-Bang Yau | 2020-12-29 |
| 10535592 | Method for forming solder bumps using sacrificial layer | Eric P. Lewandowski, Jae-Woong Nah | 2020-01-14 |
| 10168478 | Integration of photonic, electronic, and sensor devices with SOI VLSI microprocessor technology | Aydin Babakhani, Steven A. Cordes, Jean-Olivier Plouchart, Scott K. Reynolds, Robert E. Trzcinski | 2019-01-01 |
| 10168477 | Integration of photonic, electronic, and sensor devices with SOI VLSI microprocessor technology | Aydin Babakhani, Steven A. Cordes, Jean-Olivier Plouchart, Scott K. Reynolds, Robert E. Trzcinski | 2019-01-01 |
| 10103450 | Integration of area efficient antennas for phased array or wafer scale array antenna applications | Bing Dang, Duixian Liu, Jean-Olivier Plouchart, Cornelia K. Tsang | 2018-10-16 |
| 9953908 | Method for forming solder bumps using sacrificial layer | Eric P. Lewandowski, Jae-Woong Nah | 2018-04-24 |
| 9872394 | Substrate via filling | Steven A. Cordes, Bing Dang, Sung Kwon Kang, Yu Luo | 2018-01-16 |
| 9632251 | Integration of photonic, electronic, and sensor devices with SOI VLSI microprocessor technology | Aydin Babakhani, Steven A. Cordes, Jean-Olivier Plouchart, Scott K. Reynolds, Robert E. Trzcinski | 2017-04-25 |
| 9472859 | Integration of area efficient antennas for phased array or wafer scale array antenna applications | Bing Dang, Duixian Liu, Jean-Olivier Plouchart, Cornelia K. Tsang | 2016-10-18 |
| 9433101 | Substrate via filling | Steven A. Cordes, Bing Dang, Sung Kwon Kang, Yu Luo | 2016-08-30 |
| 9171742 | Alignment of integrated circuit chip stack | Evan G. Colgan, Steven A. Cordes, Daniel C. Edelstein, Vijayeshwar D. Khanna, Kenneth F. Latzko +4 more | 2015-10-27 |
| 8419895 | Laser ablation for integrated circuit fabrication | Bing Dang, John U. Knickerbocker, Aparna Prabhakar, Robert E. Trzcinski, Cornelia K. Tsang | 2013-04-16 |
| 8388782 | Handler attachment for integrated circuit fabrication | Paul S. Andry, Bing Dang, John U. Knickerbocker, Aparna Prahbakar, Robert E. Trzcinski +1 more | 2013-03-05 |
| 6228511 | Structure and process for thin film interconnect | Krishna G. Sachdev, Benedikt Maria Johannes Kellner, Kathleen Mary Mc Guire | 2001-05-08 |
| 6165629 | Structure for thin film interconnect | Krishna G. Sachdev, Benedikt Maria Johannes Kellner, Kathleen Mary McGuire | 2000-12-26 |
| 5231751 | Process for thin film interconnect | Krishna G. Sachdev, Benedikt Maria Johannes Kellner, Kathleen Mary McGuire | 1993-08-03 |