Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6165629 | Structure for thin film interconnect | Krishna G. Sachdev, Benedikt Maria Johannes Kellner, Peter J. Sorce | 2000-12-26 |
| 5891543 | Apparatus and method for screening using electrostatic adhesion | Jon A. Casey, Cynthia J. Calli, Darren T. Cook, David B. Goland, John U. Knickerbocker +8 more | 1999-04-06 |
| 5759669 | Apparatus and method for screening green sheet with via hole using porous backing material | Jon A. Casey, Cynthia J. Calli, Darren T. Cook, David B. Goland, John U. Knickerbocker +8 more | 1998-06-02 |
| 5635000 | Method for screening using electrostatic adhesion | Jon A. Casey, Cynthia J. Calli, Darren T. Cook, David B. Goland, John U. Knickerbocker +8 more | 1997-06-03 |
| 5231751 | Process for thin film interconnect | Krishna G. Sachdev, Benedikt Maria Johannes Kellner, Peter J. Sorce | 1993-08-03 |
| 4604644 | Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making | Keith F. Beckham, Anne Elizabeth Kolman, Karl J. Puttlitz, Horatio Quinones | 1986-08-05 |