Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Low temperature adhesive resins for wafer bonding

Low temperature adhesive resins for wafer bonding

US Patent 9748131 · Granted Aug 29, 2017

Estimated economic value: $2,195,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Feedstock purification of polyester waste for recycling processes2025
Feedstock engineering of polyester waste for recycling processes2025
Recycling process for the recovery of cotton from polyester-cotton fabrics and/o2025
Thermally reworkable adhesives for electronic devices2025
Media recycling and sanitization2025
Infrared debond damage mitigation by copper fill pattern2025
Mixed waste plastics compatibilizers for asphalt2025
Phytol-based surfactants and methods therefor2025
Quantum circuit with trench capacitor2024
Electronic substrate stacking2024
Thermal interface material, an integrated circuit formed therewith, and a method2024
Multi-sensor platform for health monitoring2024