Issued Patents All Time
Showing 26–50 of 153 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9275868 | Uniform roughness on backside of a wafer | Shawn A. Adderly, Jeffrey P. Gambino, Max L. Lifson, Matthew D. Moon, William J. Murphy +1 more | 2016-03-01 |
| 9269683 | Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2016-02-23 |
| 9230929 | Semiconductor structures and methods of manufacture | Timothy H. Daubenspeck, Jeffrey P. Gambino, Zhong-Xiang He, Christopher D. Muzzy, Wolfgang Sauter | 2016-01-05 |
| 9223037 | Structure and method to ensure correct operation of an integrated circuit in the presence of ionizing radiation | Ethan H. Cannon, Michael J. Hauser | 2015-12-29 |
| 9190375 | Solder bump reflow by induction heating | Stephen P. Ayotte, Sébastien S. Quesnel, Glen E. Richard, Timothy M. Sullivan | 2015-11-17 |
| 9177931 | Reducing thermal energy transfer during chip-join processing | Stephen P. Ayotte, Sébastien S. Quesnel, Glen E. Richard, Timothy M. Sullivan | 2015-11-03 |
| 9165850 | Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2015-10-20 |
| 9165831 | Dice before grind with backside metal | Timothy H. Daubenspeck, Jeffrey P. Gambino, Charles F. Musante, Christopher D. Muzzy, Wolfgang Sauter | 2015-10-20 |
| 9105465 | Wafer edge conditioning for thinned wafers | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2015-08-11 |
| 9087839 | Semiconductor structures with metal lines | Shawn A. Adderly, Daniel A. Delibac, Zhong-Xiang He, Matthew D. Moon, Anthony C. Speranza +2 more | 2015-07-21 |
| 9087754 | Structures and methods for improving solder bump connections in semiconductor devices | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2015-07-21 |
| 9059258 | Controlled metal extrusion opening in semiconductor structure and method of forming | Max G. Levy, Gary L. Milo, Matthew D. Moon, Anthony C. Speranza, David C. Thomas +1 more | 2015-06-16 |
| 9059106 | Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2015-06-16 |
| 9035459 | Structures for improving current carrying capability of interconnects and methods of fabricating the same | Charles L. Arvin, Raschid J. Bezama, Harry D. Cox, Timothy H. Daubenspeck, Krystyna W. Semkow | 2015-05-19 |
| 9029172 | On-chip poly-to-contact process monitoring and reliability evaluation system and method of use | Fen Chen, Roger A. Dufresne, Yanfeng Wang | 2015-05-12 |
| 9018760 | Solder interconnect with non-wettable sidewall pillars and methods of manufacture | Charles L. Arvin, Raschid J. Bezama, Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy +3 more | 2015-04-28 |
| 8945955 | Method of changing reflectance or resistance of a region in an optoelectronic memory device | Fen Chen, Richard S. Kontra, Tom C. Lee, Theodore M. Levin, Christopher D. Muzzy | 2015-02-03 |
| 8933540 | Thermal via for 3D integrated circuits structures | Timothy H. Daubenspeck, Jeffrey P. Gambino, Michael J. Hauser, Christopher D. Muzzy, Wolfgang Sauter | 2015-01-13 |
| 8927869 | Semiconductor structures and methods of manufacture | Timothy H. Daubenspeck, Jeffrey P. Gambino, Zhong-Xiang He, Christopher D. Muzzy, Wolfgang Sauter | 2015-01-06 |
| 8927334 | Overcoming chip warping to enhance wetting of solder bumps and flip chip attaches in a flip chip package | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Nathalie Normand, David L. Questad +1 more | 2015-01-06 |
| 8922022 | Electromigration resistant via-to-line interconnect | Baozhen Li, Paul S. McLaughlin | 2014-12-30 |
| 8916464 | Structures and methods for improving solder bump connections in semiconductor devices | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2014-12-23 |
| 8900964 | Inductors and wiring structures fabricated with limited wiring material | Hanyi Ding, Jeffrey P. Gambino, Zhong-Xiang He, Alvin J. Joseph, Anthony K. Stamper | 2014-12-02 |
| 8901738 | Method of manufacturing an enhanced electromigration performance hetero-junction bipolar transistor | Jeffrey P. Gambino, David L. Harame, Baozhen Li, Bjorn K. A. Zetterlund | 2014-12-02 |
| 8803317 | Structures for improving current carrying capability of interconnects and methods of fabricating the same | Charles L. Arvin, Raschid J. Bezama, Harry D. Cox, Timothy H. Daubenspeck, Krystyna W. Semkow | 2014-08-12 |