Issued Patents All Time
Showing 25 most recent of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10978452 | Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry | Phillip F. Chapman, Steven H. Voldman | 2021-04-13 |
| 10170476 | Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry | Phillip F. Chapman, Steven H. Voldman | 2019-01-01 |
| 9842838 | Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry | Phillip F. Chapman, Steven H. Voldman | 2017-12-12 |
| 9397010 | Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry | Phillip F. Chapman, Steven H. Voldman | 2016-07-19 |
| 9275997 | Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry | Phillip F. Chapman, Steven H. Voldman | 2016-03-01 |
| 8853789 | Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry | Phillip F. Chapman, Steven H. Voldman | 2014-10-07 |
| 8674423 | Semiconductor structure having vias and high density capacitors | Kai D. Feng, Zhong-Xiang He, Peter J. Lindgren, Robert M. Rassel | 2014-03-18 |
| 8420518 | Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry | Phillip F. Chapman, Steven H. Voldman | 2013-04-16 |
| 8288244 | Lateral passive device having dual annular electrodes | Jeffrey B. Johnson, Xuefeng Liu, Bradley A. Orner, Robert M. Rassel, David C. Sheridan | 2012-10-16 |
| 8288821 | SOI (silicon on insulator) substrate improvements | Alan B. Botula, Alvin J. Joseph, Howard S. Landis, James A. Slinkman | 2012-10-16 |
| 8234606 | Metal wiring structure for integration with through substrate vias | Alvin J. Joseph, Peter J. Lindgren, Anthony K. Stamper, Kimball M. Watson | 2012-07-31 |
| 8169007 | Asymmetric junction field effect transistor | Frederick G. Anderson, Richard A. Phelps, Robert M. Rassel, Michael J. Zierak | 2012-05-01 |
| 8138607 | Metal fill structures for reducing parasitic capacitance | Howard S. Landis, Anthony K. Stamper, Janet M. Wilson | 2012-03-20 |
| 8125013 | Structure, design structure and method of manufacturing a structure having VIAS and high density capacitors | Kai D. Feng, Zhong-Xiang Ile, Peter J. Lindgren, Robert M. Rassel | 2012-02-28 |
| 8101494 | Structure, design structure and method of manufacturing a structure having VIAS and high density capacitors | Kai D. Feng, Zhong-Xiang He, Peter J. Lindgren, Robert M. Rassel | 2012-01-24 |
| 8089126 | Method and structures for improving substrate loss and linearity in SOI substrates | Alan B. Botula, Alvin J. Joseph, Howard S. Landis, James A. Slinkman, Anthony K. Stamper | 2012-01-03 |
| 8017471 | Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry | Phillip F. Chapman, Steven H. Voldman | 2011-09-13 |
| 8008748 | Deep trench varactors | Robert M. Rassel, Eric Thompson | 2011-08-30 |
| 7968975 | Metal wiring structure for integration with through substrate vias | Alvin J. Joseph, Peter J. Lindgren, Anthony K. Stamper, Kimball M. Watson | 2011-06-28 |
| 7943445 | Asymmetric junction field effect transistor | Frederick G. Anderson, Richard A. Phelps, Robert M. Rassel, Michael J. Zierak | 2011-05-17 |
| 7868423 | Optimized device isolation | John Benoit, Natalie B. Feilchenfeld, Michael L. Gautsch, Xuefeng Liu, Robert M. Rassel +2 more | 2011-01-11 |
| 7855420 | Structure for a latchup robust array I/O using through wafer via | Phillip F. Chapman, Steven H. Voldman | 2010-12-21 |
| 7821097 | Lateral passive device having dual annular electrodes | Jeffrey B. Johnson, Xuefeng Liu, Bradley A. Orner, Robert M. Rassel, David C. Sheridan | 2010-10-26 |
| 7741681 | Latchup robust array I/O using through wafer via | Phillip F. Chapman, Steven H. Voldman | 2010-06-22 |
| 7739636 | Design structure incorporating semiconductor device structures that shield a bond pad from electrical noise | Mete Erturk, Edward J. Gordon, Robert A. Groves, Robert M. Rassel | 2010-06-15 |