Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8125013 | Structure, design structure and method of manufacturing a structure having VIAS and high density capacitors | David S. Collins, Kai D. Feng, Peter J. Lindgren, Robert M. Rassel | 2012-02-28 |