Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Dual-damascene process to fabricate thick wire structure

Dual-damascene process to fabricate thick wire structure

US Patent 9171778 · Granted Oct 27, 2015

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Fabricating photonics structure conductive pathways2025
Photonics optoelectrical system2025
Field effect transistor with shallow trench isolation features within source/dra2025
Heterojunction bipolar transistor with buried trap rich isolation region2025
High electron mobility transistors having barrier liners and integration schemes2025
Contact-over-active-gate transistor structures with contacts landed on enlarged 2025
Heterojunction bipolar transistor with buried trap rich isolation region2024
Field effect transistor2024
IC structure including porous semiconductor layer in bulk substrate adjacent tre2024
Semiconductor on insulator wafer with cavity structures2024
IC structure including porous semiconductor layer under trench isolation2024
Heterojunction bipolar transistors with stress material for improved mobility2024