Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7968975 | Metal wiring structure for integration with through substrate vias | David S. Collins, Alvin J. Joseph, Anthony K. Stamper, Kimball M. Watson | 2011-06-28 |
| 7898063 | Through substrate annular via including plug filler | Edmund J. Sprogis, Anthony K. Stamper, Kenneth J. Stein | 2011-03-01 |
| 7863180 | Through substrate via including variable sidewall profile | Edward C. Cooney, III, Dorreen Jane Ossenkop, Anthony K. Stamper | 2011-01-04 |
| 7859114 | IC chip and design structure with through wafer vias dishing correction | Edmund J. Sprogis, Anthony K. Stamper | 2010-12-28 |
| 7741226 | Optimal tungsten through wafer via and process of fabricating same | Paul S. Andry, Edward C. Cooney, III, Dorreen Jane Ossenkop, Cornelia K. Tsang | 2010-06-22 |
| 7696586 | Cobal disilicide structure | David Paul Agnello, Mary Conroy Bushey, Donna K. Johnson, Jerome B. Lasky, Kirk D. Peterson | 2010-04-13 |
| 7602068 | Dual-damascene process to fabricate thick wire structure | Douglas D. Coolbaugh, Keith E. Downes, Anthony K. Stamper | 2009-10-13 |
| 7411258 | Cobalt disilicide structure | David Paul Agnello, Mary Conroy Bushey, Donna K. Johnson, Jerome B. Lasky, Kirk D. Peterson | 2008-08-12 |
| 6797610 | Sublithographic patterning using microtrenching | Jeffrey P. Gambino, Anthony K. Stamper | 2004-09-28 |
| 6335294 | Wet cleans for cobalt disilicide processing | David Paul Agnello, Mary Conroy Bushey, Donna K. Johnson, Jerome B. Lasky, Kirk D. Peterson | 2002-01-01 |