Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8969200 | Apparatus and method for integration of through substrate vias | Jeremiah Hebding, Megha Rao, Colin Albright McDonough, Matthew David Smalley, Douglas D. Coolbaugh +3 more | 2015-03-03 |
| 8697542 | Method for thin die-to-wafer bonding | Daniel Pascual, Jeremiah Hebding, Megha Rao, Colin Albright McDonough, Douglas D. Coolbaugh +1 more | 2014-04-15 |