Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159835 | High density 3D interconnect configuration | Sanjay Dabral, Kunzhong Hu, Jun Zhai | 2024-12-03 |
| 12119304 | Very fine pitch and wiring density organic side by side chiplet integration | Sanjay Dabral, Kunzhong Hu | 2024-10-15 |
| 11735526 | High density 3D interconnect configuration | Sanjay Dabral, Kunzhong Hu, Jun Zhai | 2023-08-22 |
| 11309246 | High density 3D interconnect configuration | Sanjay Dabral, Kunzhong Hu, Jun Zhai | 2022-04-19 |
| 10115573 | Apparatus for high compressive stress film deposition to improve kit life | Junqi Wei, Kirankumar Neelasandra SAVANDAIAH, Ananthkrishna Jupudi, Yueh Sheng Ow | 2018-10-30 |
| 10102962 | Integrated magnetic passive devices using magnetic film | David P. Cappabianca, Kwan-Yu Lai | 2018-10-16 |
| 9960023 | Methods and apparatus for nodule control in a titanium-tungsten target | Junqi Wei, Yueh Sheng Ow, Ananthkrishna Jupudi, Kirankumar Neelasandra SAVANDAIAH, Xin Wang +1 more | 2018-05-01 |
| 8835308 | Methods for depositing materials in high aspect ratio features | — | 2014-09-16 |