AW

Albert Wu

Disney: 90 patents #32 of 6,686Top 1%
UN Unknown: 5 patents #3,065 of 83,584Top 4%
IN Intel: 4 patents #8,473 of 30,777Top 30%
IS Integrated Silicon Solution: 3 patents #18 of 80Top 25%
UM United Microelectronics: 3 patents #1,523 of 4,560Top 35%
WA Winbond Electronics Corporation America: 1 patents #3 of 9Top 35%
WE Winbound Electronics: 1 patents #2 of 25Top 8%
WE Windbond Electronics: 1 patents #19 of 136Top 15%
University of California: 1 patents #8,022 of 18,278Top 45%
ME Megica: 1 patents #26 of 32Top 85%
Overall (All Time): #12,472 of 4,157,543Top 1%
108
Patents All Time

Issued Patents All Time

Showing 25 most recent of 108 patents

Patent #TitleCo-InventorsDate
11200799 Traffic management via internet of things (IoT) devices Bradut Vrabete, Wen-Kuang Yu, Sam Hsu, Richard Lin, Wilson Y. Lee 2021-12-14
9768144 Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate Roawen Chen, Chung Chyung Han, Shiann-Ming Liou, Chien-Chuan Wei, Runzi Chang +2 more 2017-09-19
9659851 Method and apparatus for improving the reliability of a connection to a via in a substrate Long Wang, Scott Wu 2017-05-23
9565770 Methods of making packages using thin Cu foil supported by carrier Cu foil Sehat Sutardja, Hyun-Joo Shin 2017-02-07
9490427 Resistive random access memory cell structure Pantas Sutardja, Winston Lee, Peter Wung Lee, Runzi Chang 2016-11-08
9444510 Method and apparatus for incorporating passive devices in an integrated passive device separate from a die Poh Boon Leong, Long Wang, Sehat Sutardja 2016-09-13
9391045 Recessed semiconductor substrates and associated techniques Roawen Chen, Chung Chyung Han, Shiann-Ming Liou, Chien-Chuan Wei, Runzi Chang +2 more 2016-07-12
9368433 Method and apparatus for mounting solder balls to an exposed pad or terminal of a semiconductor package 2016-06-14
9275929 Package assembly having a semiconductor substrate Shiann-Ming Liou, Sehat Sutardja, Chuan-Cheng Cheng, Chien-Chuan Wei 2016-03-01
9275731 Systems and methods for increasing the read sensitivity of a resistive random access memory (RRAM) Pantas Sutardja, Runzi Chang, Winston Lee, Peter Wung Lee 2016-03-01
9257410 Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate Roawen Chen, Chung Chyung Han, Shiann-Ming Liou, Chien-Chuan Wei, Runzi Chang +2 more 2016-02-09
9245961 Reducing source contact to gate spacing to decrease transistor pitch Pantas Sutardja, Winston Lee, Peter Wung Lee, Chien-Chuan Wei, Runzi Chang 2016-01-26
9244115 Test engine for integrated circuit chip testing Bruce Wang, Abdul Elaydi, Chiping Ai, Hungchi Chen 2016-01-26
9214230 Resistive random access memory cell structure with reduced programming voltage Pantas Sutardja, Winston Lee, Peter Wung Lee, Runzi Chang 2015-12-15
9171744 Attaching passive components to a semiconductor package Shiann-Ming Liou 2015-10-27
9147837 Resistive memory cell and method for forming a resistive memory cell Pantas Sutardja, Winston Lee, Peter Wung Lee, Runzi Chang 2015-09-29
9142445 Method and apparatus for forming shallow trench isolation structures having rounded corners Runzi Chang 2015-09-22
9129678 Method and apparatus for reforming a memory cell of a memory Pantas Sutardja, Winston Lee, Peter Wung Lee, Runzi Chang 2015-09-08
9117734 Integrated circuit architecture for light emitting diode-based displays Wanfeng Zhang 2015-08-25
9112133 Resistive random access memory and method for controlling manufacturing of corresponding sub-resolution features of conductive and resistive elements Pantas Sutardja, Runzi Chang, Winston Lee, Peter Wung Lee 2015-08-18
9099335 Analog circuit with improved layout for mismatch optimization 2015-08-04
9087835 Structures embedded within core material and methods of manufacturing thereof Sehat Sutardja, Scott Wu 2015-07-21
9070679 Semiconductor package with a semiconductor die embedded within substrates Shiann-Ming Liou, Scott Wu 2015-06-30
9064860 Method for forming one or more vias through a semiconductor substrate and forming a redistribution layer on the semiconductor substrate Shiann-Ming Liou 2015-06-23
9047945 Systems and methods for reading resistive random access memory (RRAM) cells Pantas Sutardja, Runzi Chang, Winston Lee, Peter Wung Lee 2015-06-02