Issued Patents All Time
Showing 51–75 of 108 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8471376 | Integrated circuit packaging configurations | Shiann-Ming Liou | 2013-06-25 |
| 8462569 | Memory repair system and method | Sehat Sutardja | 2013-06-11 |
| 8423841 | Method and systems for memory testing and test data reporting during memory testing | Winston Lee, Chorng-Lii Liou | 2013-04-16 |
| 8372692 | Method of stacking flip-chip on wire-bonded chip | Shiann-Ming Liou | 2013-02-12 |
| 8368214 | Alpha shielding techniques and configurations | Nelson Tam, Chien-Chuan Wei | 2013-02-05 |
| 8338934 | Embedded die with protective interposer | Scott Wu | 2012-12-25 |
| 8330477 | Test engine for integrated circuit chip testing | Chiping Ai, Hungchi Chen, Bruce Wang, Abdul Elaydi | 2012-12-11 |
| 8319353 | Pre-formed conductive bumps on bonding pads | Shiann-Ming Liou, Huahung Kao | 2012-11-27 |
| 8241993 | Method for shallow trench isolation | Runzi Chang | 2012-08-14 |
| 8218383 | Memory repair system and method | Sehat Sutardja | 2012-07-10 |
| 8030098 | Pre-formed conductive bumps on bonding pads | Shiann-Ming Liou, Huahung Kao | 2011-10-04 |
| 8030128 | Method to form high density phase change memory (PCM) top contact every two bits | Pantas Sutardja, Runzi Chang, Chien-Chuan Wei, Winston Lee, Peter Wung Lee | 2011-10-04 |
| 8008137 | Method for fabricating 1T-DRAM on bulk silicon | Roawen Chen | 2011-08-30 |
| 8003523 | Methods for forming a plurality of contact holes in a microelectric device | Chien-Chuan Wei | 2011-08-23 |
| 7994052 | High-density patterning | Pantas Sutardja, Winston Lee, Peter Wung Lee, Chien-Chuan Wei, Runzi Chang | 2011-08-09 |
| 7985616 | Methods to form wide heater trenches and to form memory cells to engage heaters | Pantas Sutardja, Chien-Chuan Wei, Runzi Chang, Winston Lee, Peter Wung Lee | 2011-07-26 |
| 7960831 | Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same | Fay Hua, Kevin Jeng, Krishna Seshan | 2011-06-14 |
| 7958413 | Method and system for memory testing and test data reporting during memory testing | Winston Lee, Chorng-Lii Liou | 2011-06-07 |
| 7948818 | Memory repair system and method | Sehat Sutardja | 2011-05-24 |
| 7939445 | High density via and metal interconnect structures, and methods of forming the same | Pantas Sutardja, Winston Lee, Peter Wung Lee, Chien-Chuan Wei, Runzi Chang | 2011-05-10 |
| 7939414 | Ion implantation and process sequence to form smaller base pick-up | Pantas Sutardja, Chien-Chuan Wei, Runzi Chang, Winston Lee, Peter Wung Lee | 2011-05-10 |
| 7911053 | Semiconductor packaging with internal wiring bus | Chenglin Liu, Shiann-Ming Liou | 2011-03-22 |
| 7892936 | Self aligned integration of high density phase change memory with thin film access device | Runzi Chang | 2011-02-22 |
| 7888166 | Method to form high efficiency GST cell using a double heater cut | Pantas Sutardja, Runzi Chang, Chien-Chuan Wei, Winston Lee, Peter Wung Lee | 2011-02-15 |
| 7863709 | Low base resistance bipolar junction transistor array | Pantas Sutardja, Runzi Chang, Chien-Chuan Wei, Winston Lee, Peter Wung Lee | 2011-01-04 |