Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12199003 | Packaging stacked substrates and an integrated circuit die using a lid and a stiffening structure | Luke England, Richard S. Graf, Ronen Sinai | 2025-01-14 |
| 11469295 | Decoupling capacitor integrated in system on chip (SOC) device | Runzi Chang | 2022-10-11 |
| 11282762 | Heat sink design for flip chip ball grid array | Chenglin Liu | 2022-03-22 |
| 10128171 | Leadframe with improved half-etch layout to reduce defects caused during singulation | Shiann-Ming Liou | 2018-11-13 |
| 9666571 | Package-on-package structures | Shiann-Ming Liou | 2017-05-30 |
| 9543236 | Pad configurations for an electronic package assembly | Sehat Sutardja, Shiann-Ming Liou | 2017-01-10 |
| 9524927 | Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types | Tyson Leistiko, Wayne A. Loeb | 2016-12-20 |
| 9355951 | Interconnect layouts for electronic assemblies | Shiann-Ming Liou | 2016-05-31 |
| 9331052 | Pad configurations for an electronic package assembly | Sehat Sutardja, Shiann-Ming Liou | 2016-05-03 |
| 9209163 | Package-on-package structures | Shiann-Ming Liou | 2015-12-08 |
| 9123699 | Formation of package pins in semiconductor packaging | Chenglin Liu, Shiann-Ming Liou | 2015-09-01 |
| 8963342 | Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types | Tyson Leistiko | 2015-02-24 |
| 8940585 | Single layer BGA substrate process | Shiann-Ming Liou | 2015-01-27 |
| 8912664 | Leadless multi-chip module structure | Shiann-Ming Liou | 2014-12-16 |
| 8860193 | Pad configurations for an electronic package assembly | Sehat Sutardja, Shiann-Ming Liou | 2014-10-14 |
| 8686547 | Stack die structure for stress reduction and facilitation of electromagnetic shielding | Thomas Ngo, Shiann-Ming Liou | 2014-04-01 |
| 8673689 | Single layer BGA substrate process | Shiann-Ming Liou | 2014-03-18 |
| 8669139 | Leadless multi-chip module structure | Shiann-Ming Liou | 2014-03-11 |
| 8455347 | Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types | Tyson Leistiko | 2013-06-04 |
| 8405220 | Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types | Wayne A. Loeb, Tyson Leistiko | 2013-03-26 |
| 8358013 | Leadless multi-chip module structure | Shiann-Ming Liou | 2013-01-22 |
| 8319353 | Pre-formed conductive bumps on bonding pads | Shiann-Ming Liou, Albert Wu | 2012-11-27 |
| 8030098 | Pre-formed conductive bumps on bonding pads | Shiann-Ming Liou, Albert Wu | 2011-10-04 |
| 7999395 | Pillar structure on bump pad | Shiann-Ming Liou | 2011-08-16 |
| 7956474 | Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types | Tyson Leistiko | 2011-06-07 |