Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12199003 | Packaging stacked substrates and an integrated circuit die using a lid and a stiffening structure | Luke England, Richard S. Graf, Huahung Kao | 2025-01-14 |
| 11088123 | Package system having laterally offset and ovelapping chip packages | Dan Azeroual | 2021-08-10 |
| 10438881 | Packaging arrangements including high density interconnect bridge | Long Wang, Lijuan Zhang | 2019-10-08 |