Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12295094 | Pad and via pattern arrangement for differential signal shielding | Liav Ben Artsi, David Katz | 2025-05-06 |
| 11967587 | IC package with top-side memory module | Liav Ben Artsi | 2024-04-23 |
| 11917749 | Integrated circuit package differential pin pattern for cross-talk reduction | Liav Ben Artsi | 2024-02-27 |
| 11581292 | IC package with top-side memory module | Liav Ben Artsi | 2023-02-14 |
| 11508663 | PCB module on package | Eldad Bar-Lev | 2022-11-22 |
| 11088123 | Package system having laterally offset and ovelapping chip packages | Ronen Sinai | 2021-08-10 |
| 11004778 | Polygonal BGA semiconductor package | William B. Weiser | 2021-05-11 |
| 9565762 | Power delivery network in a printed circuit board structure | Eldad Bar-Lev | 2017-02-07 |
| 9089060 | Ball-out for differential signals | Liav Ben Artsi | 2015-07-21 |
| 9083348 | Method and apparatus for tuning delay | Meir Hasko | 2015-07-14 |
| 8803339 | Bump out for differential signals | — | 2014-08-12 |
| 8164348 | Method and apparatus for tuning delay | Meir Hasko | 2012-04-24 |
| 7838778 | Circuit board layout | Meir Hasko | 2010-11-23 |