Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12295094 | Pad and via pattern arrangement for differential signal shielding | Dan Azeroual, David Katz | 2025-05-06 |
| 11967587 | IC package with top-side memory module | Dan Azeroual | 2024-04-23 |
| 11917749 | Integrated circuit package differential pin pattern for cross-talk reduction | Dan Azeroual | 2024-02-27 |
| 11789067 | Physical layer parameter compliance in high speed communication networks | — | 2023-10-17 |
| 11581292 | IC package with top-side memory module | Dan Azeroual | 2023-02-14 |
| 9921596 | Power supply noise reduction circuit and power supply noise reduction method | — | 2018-03-20 |
| 9143368 | Systems and methods for reducing quantization errors using adjustable equalizer granularities | Miki Moyal | 2015-09-22 |
| 9124461 | Method and apparatus for reducing jitter | Ido Bourstein | 2015-09-01 |
| 9089060 | Ball-out for differential signals | Dan Azeroual | 2015-07-21 |
| 8922246 | System and process for overcoming wire-bond originated cross-talk | — | 2014-12-30 |
| 8884644 | Impedance discontinuity compensator for electronic packages | — | 2014-11-11 |
| 8866563 | Connector based compensation of via stub effects | — | 2014-10-21 |
| 8502342 | Circuits, systems, and methods for reducing effects of cross talk in I/O lines and wire bonds | — | 2013-08-06 |
| 8466712 | Direct current (DC) coupling with rail to rail common mode | Shimon Avitan | 2013-06-18 |
| 8319313 | Circuits, systems, and methods for reducing effects of cross talk in I/O lines and wire bonds | — | 2012-11-27 |
| 8274307 | Impedance discontinuity compensator for electronic packages | — | 2012-09-25 |
| 7456655 | System and process for overcoming wire-bond originated cross-talk | — | 2008-11-25 |