Issued Patents All Time
Showing 26–29 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7825521 | Stack die packages | Albert Wu | 2010-11-02 |
| 7586199 | Structures, architectures, systems, methods, algorithms and software for configuring and integrated circuit for multiple packaging types | Tyson Leistiko | 2009-09-08 |
| 7560309 | Drop-in heat sink and exposed die-back for molded flip die package | Shiann-Ming Liou | 2009-07-14 |
| 7535110 | Stack die packages | Albert Wu | 2009-05-19 |