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Home › Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages

Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages

US Patent 8441118 · Granted May 14, 2013

Estimated economic value: $17,697,000 ⓘ

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