Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9036612 | Wireless communication method and system with collision avoidance protocol | Mikael Gidlund, Dong Yang, Wei Shen, Tingting Zhang | 2015-05-19 |
| 8354467 | Underfill formulation and method of increasing an adhesion property of same | Linda A. Shekhawat, Gregory S. Constable, Nisha Anathakrishan | 2013-01-15 |
| 7926697 | Underfill formulation and method of increasing an adhesion property of same | Linda A. Shekhawat, Gregory S. Constable, Nisha Ananthakrishan | 2011-04-19 |
| 7704798 | Electronic assemblies with hot spot cooling and methods relating thereto | Fay Hua, Carl Deppisch, Joni G. Hansen | 2010-04-27 |
| 7489033 | Electronic assembly with hot spot cooling | Fay Hua, Carl Deppisch, Joni G. Hansen | 2009-02-10 |
| 6761813 | Heat transfer through covalent bonding of thermal interface material | — | 2004-07-13 |