Issued Patents All Time
Showing 26–49 of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7449780 | Apparatus to minimize thermal impedance using copper on die backside | Gregory M. Chrysler, James G. Maveety, Kramadhati V. Ravi | 2008-11-11 |
| 7439617 | Capillary underflow integral heat spreader | Carl Deppisch, Tom Fitzgerald, Wei Shi, Mike Gasparek | 2008-10-21 |
| 7436058 | Reactive solder material | Carl Deppisch, Krista J. Whittenburg | 2008-10-14 |
| 7391112 | Capping copper bumps | Jianxing Li, Ming Fang, Ting Zhong, Kevin J. Lee | 2008-06-24 |
| 7362580 | Electronic assembly having an indium wetting layer on a thermally conductive body | Thomas J. Fitzgerald, Carl Deppisch, Gregory M. Chrysler | 2008-04-22 |
| 7314819 | Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same | Albert Wu, Kevin Jeng, Krishna Seshan | 2008-01-01 |
| 7256058 | Device and method for package warp compensation in an integrated heat spreader | Thomas J. Fitzgerald, Carl Deppisch | 2007-08-14 |
| 7242097 | Electromigration barrier layers for solder joints | — | 2007-07-10 |
| 7223695 | Methods to deposit metal alloy barrier layers | Ting Zhong, Valery M. Dubin | 2007-05-29 |
| 7208830 | Interconnect shunt used for current distribution and reliability redundancy | Mark Bohr, Jun He, Dustin P. Wood | 2007-04-24 |
| 7164585 | Thermal interface apparatus, systems, and methods | Susheel Jadhav, Carl Deppisch | 2007-01-16 |
| 7122460 | Electromigration barrier layers for solder joints | — | 2006-10-17 |
| 7111771 | Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making same | — | 2006-09-26 |
| 7102226 | Device and method for package warp compensation in an integrated heat spreader | Thomas J. Fitzgerald, Carl Deppisch | 2006-09-05 |
| 7081669 | Device and system for heat spreader with controlled thermal expansion | Thomas J. Fitzgerald, Carl Deppisch | 2006-07-25 |
| 7036573 | Polymer with solder pre-coated fillers for thermal interface materials | Paul A. Koning, Carl Deppisch | 2006-05-02 |
| 6867978 | Integrated heat spreader package for heat transfer and for bond line thickness control and process of making | Kris Whittenburg, Carl Deppisch, Sabina J. Houle, Peter Brandenburger, Kim Phillippe | 2005-03-15 |
| 6857557 | Low temperature microelectronic die to substrate interconnects | — | 2005-02-22 |
| 6848172 | Device and method for package warp compensation in an integrated heat spreader | Thomas J. Fitzgerald, Carl Deppisch | 2005-02-01 |
| 6817091 | Electronic assembly having solder thermal interface between a die substrate and a heat spreader | Thomas J. Fitzgerald, Carl Deppisch | 2004-11-16 |
| 6813153 | Polymer solder hybrid | Paul A. Koning | 2004-11-02 |
| 6504242 | Electronic assembly having a wetting layer on a thermally conductive heat spreader | Carl Deppisch, Sabina J. Houle, Thomas J. Fitzgerald, Kristopher E. Dayton | 2003-01-07 |
| 6504723 | Electronic assembly having solder thermal interface between a die substrate and a heat spreader | Thomas J. Fitzgerald, Carl Deppisch | 2003-01-07 |
| 6214131 | Mixed solder pastes for low-temperature soldering process | — | 2001-04-10 |