Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522455 | Integrated circuit package substrate | Mathew J. Manusharow, Debendra Mallik | 2019-12-31 |
| 10242942 | Integrated circuit package substrate | Mathew J. Manusharow, Debendra Mallik | 2019-03-26 |
| 7755165 | iTFC with optimized C(T) | Cengiz A. Palanduz | 2010-07-13 |
| 7687905 | Integrated circuit packages, systems, and methods | Brent Stone, Kaladhar Radhakrishnan | 2010-03-30 |
| 7667320 | Integrated circuit package with improved power signal connection | Kaladhar Radhakrishnan | 2010-02-23 |
| 7656644 | iTFC with optimized C(T) | Cengiz A. Palanduz | 2010-02-02 |
| 7524754 | Interconnect shunt used for current distribution and reliability redundancy | Mark Bohr, Jun He, Fay Hua | 2009-04-28 |
| 7495336 | Array capacitors for broadband decoupling applications | Joel Auernheimer, Nicholas Holmberg, Kaladhar Radhakrishnan | 2009-02-24 |
| 7463492 | Array capacitors with voids to enable a full-grid socket | Kaladhar Radhakrishnan, Nicholas Holmberg | 2008-12-09 |
| 7375412 | iTFC with optimized C(T) | Cengiz A. Palanduz | 2008-05-20 |
| 7365428 | Array capacitor with resistive structure | Joel Auernheimer, Nicholas Holmberg, Kaladhar Radhakrishnan | 2008-04-29 |
| 7355836 | Array capacitor for decoupling multiple voltage rails | Kaladhar Radhakrishnan, Nicholas Holmberg, Joel Auernheimer | 2008-04-08 |
| 7348214 | Integrated circuit package with improved power signal connection | Kaladhar Radhakrishnan | 2008-03-25 |
| 7339263 | Integrated circuit packages, systems, and methods | Brent Stone, Kaladhar Radhakrishnan | 2008-03-04 |
| 7321172 | Selective plating of package terminals | Debendra Mallik | 2008-01-22 |
| 7265995 | Array capacitors with voids to enable a full-grid socket | Kaladhar Radhakrishnan, Nicholas Holmberg | 2007-09-04 |
| 7243423 | Chip package with degassing holes | — | 2007-07-17 |
| 7208830 | Interconnect shunt used for current distribution and reliability redundancy | Mark Bohr, Jun He, Fay Hua | 2007-04-24 |
| 7186645 | Selective plating of package terminals | Debendra Mallik | 2007-03-06 |
| 7183644 | Integrated circuit package with improved power signal connection | Kaladhar Radhakrishnan | 2007-02-27 |
| 7173804 | Array capacitor with IC contacts and applications | Kaladhar Radhakrishnan, Larry E. Mosley, Nicholas Holmberg | 2007-02-06 |
| 7152313 | Package substrate for integrated circuit and method of making the substrate | Mark Thurston, Mahadevan Suryakumar | 2006-12-26 |
| 6979891 | Integrated circuit packaging architecture | Brent Stone | 2005-12-27 |
| 6867491 | Metal core integrated circuit package with electrically isolated regions and associated methods | John S. Guzek | 2005-03-15 |
| 6831233 | Chip package with degassing holes | — | 2004-12-14 |