Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7152313 | Package substrate for integrated circuit and method of making the substrate | Dustin P. Wood, Mahadevan Suryakumar | 2006-12-26 | $11,208,000 |
| 6381136 | Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges | Daryl J. Nelson, Michael Stark, Michael Rutigliano, Lee Topic, Yoke Dou Chung | 2002-04-30 | $84,693,000 |
| 6046905 | Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges | Daryl J. Nelson, Michael Stark, Michael Rutigliano, Lee Topic, Yoke Dou Chung | 2000-04-04 | $215,158,000 |
| 5883782 | Apparatus for attaching a heat sink to a PCB mounted semiconductor package | Hong Xie | 1999-03-16 | $139,495,000 |