Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7152313 | Package substrate for integrated circuit and method of making the substrate | Dustin P. Wood, Mahadevan Suryakumar | 2006-12-26 |
| 6381136 | Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges | Daryl J. Nelson, Michael Stark, Michael Rutigliano, Lee Topic, Yoke Dou Chung | 2002-04-30 |
| 6046905 | Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges | Daryl J. Nelson, Michael Stark, Michael Rutigliano, Lee Topic, Yoke Dou Chung | 2000-04-04 |
| 5883782 | Apparatus for attaching a heat sink to a PCB mounted semiconductor package | Hong Xie | 1999-03-16 |