Issued Patents All Time
Showing 26–29 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6819543 | Multilayer capacitor with multiple plates per layer | Raymond A. Vieweg, Nicholas Holmberg | 2004-11-16 |
| 6501166 | Stitched plane structure and process for package power delivery and dual referenced stripline I/O performance | Seng Hooi Ong, Edward A. Burton | 2002-12-31 |
| 6429051 | Stitched plane structure for package power delivery and dual referenced stripline I/O performance | Seng Hooi Ong, Edward A. Burton | 2002-08-06 |
| 6225687 | Chip package with degassing holes | — | 2001-05-01 |