Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6664483 | Electronic package with high density interconnect and associated methods | Tee Onn Chong, Robert L. Sankman | 2003-12-16 |
| 6501166 | Stitched plane structure and process for package power delivery and dual referenced stripline I/O performance | Dustin P. Wood, Edward A. Burton | 2002-12-31 |
| 6429051 | Stitched plane structure for package power delivery and dual referenced stripline I/O performance | Dustin P. Wood, Edward A. Burton | 2002-08-06 |