Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6664483 | Electronic package with high density interconnect and associated methods | Seng Hooi Ong, Robert L. Sankman | 2003-12-16 |
| 6362438 | Enhanced plated-through hole and via contact design | Chris Baldwin, Chee-Yee Chung | 2002-03-26 |