| 12121959 |
Three-plate die casting mold having a sprue system and improved sprue separation, and die casting method |
Fritz Hirning, Jean-Marc SEGAUD, Klaus-Peter Tucan |
2024-10-22 |
$9,876,000 |
| 12046577 |
Stacked memory with interface providing offset interconnects |
Pete D. Vogt, Warren R. Morrow, John B. Halbert, Jin-Sung Kim, Kenneth D. Shoemaker |
2024-07-23 |
|
| 12017270 |
Three-plate pressure die casting mold having improved sprue separation, and method for pressure die casting |
Olaf Hentschel, Manfred Tremmel |
2024-06-25 |
$16,830,000 |
| 11964323 |
Three-plate pressure die casting mold having improved sprue separation, and method for pressure die casting (II) |
Olaf Hentschel, Manfred Tremmel |
2024-04-23 |
$21,806,000 |
| 10851516 |
Shaft cover for shafts, channel entrances, or drainage channels |
Torsten Hensel, Patrick Frey, Helge Weiler-Schlecker, Andreas Wuest, Kay Michael Brockmueller +2 more |
2020-12-01 |
|
| 10853216 |
Mechanism for facilitating write tracking for following data eye movements across changing thermal conditions in memory systems |
Tsun Ho Liu, Hoi M. Ng, Guy R. Murray, Oleg Mikulchenko, Xiaofang Gao |
2020-12-01 |
$25,476,000 |
| 10079489 |
Power management in multi-die assemblies |
Guido Droege, Uwe Zillmann |
2018-09-18 |
$29,867,000 |
| 9921640 |
Integrated voltage regulators with magnetically enhanced inductors |
Uwe Zillmann, Ruchir Saraswat, Telesphor Kamgaing, Paul B. Fischer, Guido Droege |
2018-03-20 |
$13,809,000 |
| 9911689 |
Through-body-via isolated coaxial capacitor and techniques for forming same |
Kevin J. Lee, Ruchir Saraswat, Uwe Zillmann, Nicholas P. Cowley, Rinkle Jain +1 more |
2018-03-06 |
$18,859,000 |
| 9768148 |
Stacked memory with interface providing offset interconnects |
Pete D. Vogt, Warren R. Morrow, John B. Halbert, Jin-Sung Kim, Kenneth D. Shoemaker |
2017-09-19 |
$8,005,000 |
| 9472249 |
Techniques for accessing a dynamic random access memory array |
Jen-Chieh Yeh, Pei-Wen Luo |
2016-10-18 |
$9,528,000 |
| 9391453 |
Power management in multi-die assemblies |
Guido Droege, Uwe Zillmann |
2016-07-12 |
$10,128,000 |
| 9361970 |
Configuration for power reduction in DRAM |
John B. Halbert |
2016-06-07 |
$9,646,000 |
| 9311983 |
Dynamically applying refresh overcharge voltage to extend refresh cycle time |
— |
2016-04-12 |
$10,096,000 |
| 9287196 |
Resonant clocking for three-dimensional stacked devices |
Ruchir Saraswat, Uwe Zillmann, Tor Lund-Larsen |
2016-03-15 |
$12,478,000 |
| 9263422 |
Interlayer communications for 3D integrated circuit stack |
Guido Droege, Niklas Linkewitsch |
2016-02-16 |
$10,295,000 |
| 9229466 |
Fully integrated voltage regulators for multi-stack integrated circuit architectures |
Ruchir Saraswat, Uwe Zillman, Andreas Duevel, Valluri Rao, Telesphor Kamgaing +1 more |
2016-01-05 |
$11,513,000 |
| 9230614 |
Separate microchannel voltage domains in stacked memory architecture |
Ruchir Saraswat |
2016-01-05 |
$11,513,000 |
| 9135982 |
Techniques for accessing a dynamic random access memory array |
Jen-Chieh Yeh, Pei-Wen Luo |
2015-09-15 |
$17,844,000 |
| 9086881 |
Mechanism for facilitating write tracking for following data eye movements across changing thermal conditions in memory systems |
Tsun Ho Liu, Hoi M. Ng, Guy R. Murray, Oleg Mikulchenko, Xiaofang Gao |
2015-07-21 |
$13,511,000 |
| 9087559 |
Memory sense amplifier voltage modulation |
— |
2015-07-21 |
$13,511,000 |
| 9026767 |
Adaptive address mapping with dynamic runtime memory mapping selection |
Matthias Gries |
2015-05-05 |
$18,811,000 |
| 9000577 |
Interlayer communications for 3D integrated circuit stack |
Guido Droege, Niklas Linkewitsch |
2015-04-07 |
$25,687,000 |
| 8971087 |
Stacked memory with interface providing offset interconnects |
Pete D. Vogt, Warren R. Morrow, John B. Halbert, Jin-Sung Kim, Kenneth D. Shoemaker |
2015-03-03 |
$18,773,000 |
| 8959271 |
System and method for accessing memory |
— |
2015-02-17 |
$23,949,000 |
