Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Interlayer communications for 3D integrated circuit stack

Interlayer communications for 3D integrated circuit stack

US Patent 9263422 · Granted Feb 16, 2016

Estimated economic value: $10,295,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Three-plate die casting mold having a sprue system and improved sprue separation2024
Stacked memory with interface providing offset interconnects2024
Three-plate pressure die casting mold having improved sprue separation, and meth2024
Three-plate pressure die casting mold having improved sprue separation, and meth2024
Voltage-divider circuits and circuitry2023
Shaft cover for shafts, channel entrances, or drainage channels2020
Mechanism for facilitating write tracking for following data eye movements acros2020
Processing circuitry comprising a current-compensation unit2020
Analogue-to-digital converter circuitry comprising capacitive successive-approxi2020
Semiconductor integrated circuitry2020
Analogue-to-digital converter circuitry employing an alignment signal2020
Evaluation circuitry2020