Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Power management in multi-die assemblies

Power management in multi-die assemblies

US Patent 9391453 · Granted Jul 12, 2016

Estimated economic value: $10,128,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Three-plate die casting mold having a sprue system and improved sprue separation2024
Stacked memory with interface providing offset interconnects2024
Three-plate pressure die casting mold having improved sprue separation, and meth2024
Three-plate pressure die casting mold having improved sprue separation, and meth2024
Method and apparatus for forming backside die planar devices and saw filter2021
Shaft cover for shafts, channel entrances, or drainage channels2020
Mechanism for facilitating write tracking for following data eye movements acros2020
Die with integrated microphone device using through-silicon vias (TSVs)2019
Backside redistribution layer patch antenna2019
Method and apparatus for forming backside die planar devices and saw filter2019
Integrated inductor for integrated circuit devices2019
Power management in multi-die assemblies2018