Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8236691 | Method of high aspect ratio plug fill | Yakov Shor, Maor Rotlain, Yigal Alon, Dror Horvitz | 2012-08-07 |
| 7935627 | Forming low dielectric constant dielectric materials | Yakov Shor, Valery Shumilin, Alexander Ripp | 2011-05-03 |
| 7510907 | Through-wafer vias and surface metallization for coupling thereto | John Heck, Qing Ma, Quan Tran, Tsung-Kuan A. Chou, Boaz Weinfeld | 2009-03-31 |