Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10580717 | Multiple-chip package with multiple thermal interface materials | Hemanth K. Dhavaleswarapu, Syadwad Jain, James C. Matayabas, Jr. | 2020-03-03 | $18,388,000 |