Paul R. Start has been granted 10 US patents while listed as an inventor at Intel . The first was granted in 2013 and the most recent in December 2024. Paul R. Start ranks #481,000 of 4,157,543 US inventors in our database (top 11.6%). Patent records list Paul R. Start in Chandler, AZ, US.
Patents per Year Patents granted per year, 2013 to 2024 Bar chart with a peak of 2 patents in 2014. peak 2 2013: 1 patents 2013 2014: 2 patents 2014 2015: 1 patents 2015 2016: 1 patents 2016 2019: 1 patents 2019 2021: 1 patents 2021 2023: 2 patents 2023 2024: 1 patents 2024
Issued Patents All Time
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Showing 1–10 of 10 patents
Patent # Title Co-Inventors Date Approx Value ⓘ
12159813 Embedded bridge die with through-silicon vias Aditya S. Vaidya , Ravindranath V. Mahajan , Digvijay A. Raorane 2024-12-03
$28,395,000
11804470 Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage control Xavier Francois Brun , Kaizad Mistry , Nisha Ananthakrishnan , Yawei Liang , Jigneshkumar P. Patel +2 more 2023-10-31
$30,374,000
11587851 Embedded bridge with through-silicon vias Aditya S. Vaidya , Ravindranath V. Mahajan , Digvijay A. Raorane 2023-02-21
$13,703,000
11049798 Embedded bridge with through-silicon Vias Aditya S. Vaidya , Ravindranath V. Mahajan , Digvijay A. Raorane 2021-06-29
$34,663,000
10373893 Embedded bridge with through-silicon vias Aditya S. Vaidya , Ravindranath V. Mahajan , Digvijay A. Raorane 2019-08-06
$15,127,000
9461014 Methods of forming ultra thin package structures including low temperature solder and structures formed therby Sriram Srinivasan , Ram Viswanath , Rajen S. Sidhu , Rajasekaran Swaminathan 2016-10-04
$11,494,000
9064971 Methods of forming ultra thin package structures including low temperature solder and structures formed therby Sriram Srinivasan , Ram Viswanath , Rajen S. Sidhu , Rajasekaran Swaminathan 2015-06-23
$16,735,000
8866290 Molded heat spreaders Zhizhong Tang , Syadwad Jain 2014-10-21
$23,195,000
8703536 In-situ foam material as integrated heat spreader (IHS) sealant Rahul N. Manepalli 2014-04-22
$10,911,000
8508040 In-situ foam materials as integrated heat spreader (IHS) sealant Rahul N. Manepalli 2013-08-13
$12,122,000
