Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159813 | Embedded bridge die with through-silicon vias | Aditya S. Vaidya, Ravindranath V. Mahajan, Digvijay A. Raorane | 2024-12-03 |
| 11804470 | Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage control | Xavier Francois Brun, Kaizad Mistry, Nisha Ananthakrishnan, Yawei Liang, Jigneshkumar P. Patel +2 more | 2023-10-31 |
| 11587851 | Embedded bridge with through-silicon vias | Aditya S. Vaidya, Ravindranath V. Mahajan, Digvijay A. Raorane | 2023-02-21 |
| 11049798 | Embedded bridge with through-silicon Vias | Aditya S. Vaidya, Ravindranath V. Mahajan, Digvijay A. Raorane | 2021-06-29 |
| 10373893 | Embedded bridge with through-silicon vias | Aditya S. Vaidya, Ravindranath V. Mahajan, Digvijay A. Raorane | 2019-08-06 |
| 9461014 | Methods of forming ultra thin package structures including low temperature solder and structures formed therby | Sriram Srinivasan, Ram Viswanath, Rajen S. Sidhu, Rajasekaran Swaminathan | 2016-10-04 |
| 9064971 | Methods of forming ultra thin package structures including low temperature solder and structures formed therby | Sriram Srinivasan, Ram Viswanath, Rajen S. Sidhu, Rajasekaran Swaminathan | 2015-06-23 |
| 8866290 | Molded heat spreaders | Zhizhong Tang, Syadwad Jain | 2014-10-21 |
| 8703536 | In-situ foam material as integrated heat spreader (IHS) sealant | Rahul N. Manepalli | 2014-04-22 |
| 8508040 | In-situ foam materials as integrated heat spreader (IHS) sealant | Rahul N. Manepalli | 2013-08-13 |