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Embedded bridge die with through-silicon vias |
Aditya S. Vaidya, Ravindranath V. Mahajan, Digvijay A. Raorane |
2024-12-03 |
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Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage control |
Xavier Francois Brun, Kaizad Mistry, Nisha Ananthakrishnan, Yawei Liang, Jigneshkumar P. Patel +2 more |
2023-10-31 |
| 11587851 |
Embedded bridge with through-silicon vias |
Aditya S. Vaidya, Ravindranath V. Mahajan, Digvijay A. Raorane |
2023-02-21 |
| 11049798 |
Embedded bridge with through-silicon Vias |
Aditya S. Vaidya, Ravindranath V. Mahajan, Digvijay A. Raorane |
2021-06-29 |
| 10373893 |
Embedded bridge with through-silicon vias |
Aditya S. Vaidya, Ravindranath V. Mahajan, Digvijay A. Raorane |
2019-08-06 |
| 9461014 |
Methods of forming ultra thin package structures including low temperature solder and structures formed therby |
Sriram Srinivasan, Ram Viswanath, Rajen S. Sidhu, Rajasekaran Swaminathan |
2016-10-04 |
| 9064971 |
Methods of forming ultra thin package structures including low temperature solder and structures formed therby |
Sriram Srinivasan, Ram Viswanath, Rajen S. Sidhu, Rajasekaran Swaminathan |
2015-06-23 |
| 8866290 |
Molded heat spreaders |
Zhizhong Tang, Syadwad Jain |
2014-10-21 |
| 8703536 |
In-situ foam material as integrated heat spreader (IHS) sealant |
Rahul N. Manepalli |
2014-04-22 |
| 8508040 |
In-situ foam materials as integrated heat spreader (IHS) sealant |
Rahul N. Manepalli |
2013-08-13 |