Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804470 | Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage control | Xavier Francois Brun, Kaizad Mistry, Paul R. Start, Nisha Ananthakrishnan, Yawei Liang +2 more | 2023-10-31 |
| 11235436 | Abrasive articles and methods of forming the same | Andrew B. Schoch, Alexander NASHED, Sena Ada Carleen, Dean S. Matsumoto, Anne M. Bonner +3 more | 2022-02-01 |
| 10913844 | Plasticized thermoset resin, and associated cured resin, method of curing, and article comprising cured resin | Shaw Ling Hsu, Subrajeet Deshmukh, Caixia Zhao | 2021-02-09 |
| 10815329 | Plasticized thermoset resin, and associated cured resin, method of curing, and article comprising cured resin | Shaw Ling Hsu | 2020-10-27 |