Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage control

Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage control

US Patent 11804470 · Granted Oct 31, 2023

Estimated economic value: $30,374,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Multi-chip packaging2025
Moisture seal coating of hybrid bonded stacked die package assembly2025
Hybrid bonding technologies with thermal expansion compensation structures2025
Microelectronics package comprising a package-on-package (PoP) architecture with2025
Microelectronic assemblies including interconnects with different solder materia2025
Systems and methods for suppressing sound leakage2025
Systems and methods for suppressing sound leakage2025
Neural network training method, image classification system, and related device2025
Low cost embedded integrated circuit dies2025
Microelectronics package comprising a package-on-package (PoP) architecture with2025
Microelectronic assemblies with direct attach to circuit boards2025
Semiconductor device stack-up with bulk substrate material to mitigate hot spots2025