{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Embedded bridge with through-silicon Vias", "item": "https://www.patentleaderboard.com/patent/11049798"}]}
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Home › Embedded bridge with through-silicon Vias

Embedded bridge with through-silicon Vias

US Patent 11049798 · Granted Jun 29, 2021

Estimated economic value: $34,663,000 ⓘ

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