Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11626336 | Package comprising a solder resist layer configured as a seating plane for a device | Daniel Gutiérrez Garcia, Kinfegebriel Amera Mengistie, Francesco Carrara, Chang-Ho Lee, Ashish Alawani +4 more | 2023-04-11 | $12,775,000 |
| 11189575 | Specialized surface mount device for symmetric heat distribution in package | Bin Xu, Wen Yin, Yonghao An | 2021-11-30 | $28,994,000 |