Issued Patents All Time
Showing 26–50 of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9716084 | Multichip integration with through silicon via (TSV) die embedded in package | Digvijay A. Raorane, Rahul N. Manepalli, Javier Soto Gonzalez | 2017-07-25 |
| 9648733 | Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method | Islam A. Salama, Charan Gurumurthy, Hamid Azimi | 2017-05-09 |
| 9646854 | Embedded circuit patterning feature selective electroless copper plating | Aritra Dhar, Dilan Seneviratne, Jon M. Williams | 2017-05-09 |
| 9554472 | Panel with releasable core | Ching-Ping Janet Shen, Ravi Shankar, Dilan Seneviratne, Charan Gurumurthy | 2017-01-24 |
| 9442286 | Spaced configuration of acousto-optic deflectors for laser beam scanning of a semiconductor substrate | Islam A. Salama, Chong Zhang | 2016-09-13 |
| 9397079 | Multichip integration with through silicon via (TSV) die embedded in package | Digvijay A. Raorane, Rahul N. Manepalli, Javier Soto Gonzalez | 2016-07-19 |
| 9113547 | Same layer microelectronic circuit patterning using hybrid laser projection patterning (LPP) and semi-additive patterning(SAP) | John S. Guzek | 2015-08-18 |
| 9000599 | Multichip integration with through silicon via (TSV) die embedded in package | Digvijay A. Raorane, Rahul N. Manepalli, Javier Soto Gonzalez | 2015-04-07 |
| 8928151 | Hybrid core through holes and vias | Mihir K. Roy, Islam A. Salama | 2015-01-06 |
| 8877565 | Method of forming a multilayer substrate core structure using sequential microvia laser drilling and substrate core structure formed according to the method | Islam A. Salama, Charan Gurumurthy | 2014-11-04 |
| 8552564 | Hybrid-core through holes and vias | Mihir K. Roy, Islam A. Salama | 2013-10-08 |
| 8456016 | Method and core materials for semiconductor packaging | Amruthavalli Pallavi Alur, Devarajan Balaraman, Xiwang Qi, Charan Gurumurthy | 2013-06-04 |
| 8440916 | Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method | Islam A. Salama, Charan Gurumurthy, Hamid Azimi | 2013-05-14 |
| 8318536 | Utilizing aperture with phase shift feature in forming microvias | — | 2012-11-27 |
| 8288682 | Forming micro-vias using a two stage laser drilling process | Islam A. Salama | 2012-10-16 |
| 8227706 | Coaxial plated through holes (PTH) for robust electrical performance | Mihir K. Roy, Mahadevan Suryakumar | 2012-07-24 |
| 8183496 | Method of forming a pattern on a work piece, method of shaping a beam of electromagnetic radiation for use in said method, and aperture for shaping a beam of electromagnetic radiation | Islam A. Salama | 2012-05-22 |
| 7923059 | Method of enabling selective area plating on a substrate | Omar J. Bchir, Houssam Jomaa, Islam A. Salama | 2011-04-12 |
| 7891091 | Method of enabling selective area plating on a substrate | Islam A. Salama | 2011-02-22 |
| 7749900 | Method and core materials for semiconductor packaging | Amruthavalli Pallavi Alur, Devarajan Balaraman, Xiwang Qi, Charan Gurumurthy | 2010-07-06 |
| 7603883 | Method of drawing a ceramic | Nathaniel R. Quick, Aravinda Kar, Raymond R. McNeice | 2009-10-20 |
| 7583871 | Substrates for optical die structures | Omar J. Bchir, Islam A. Salama, Charan Gurumurthy, Houssam Jomaa, Ravi Kiran Nalla | 2009-09-01 |
| 7485017 | Pin grid array package substrate including pins having anchoring elements | Mengzhi Pang | 2009-02-03 |
| 7407878 | Method of providing solder bumps on a substrate using localized heating | — | 2008-08-05 |
| 7237422 | Method of drawing a composite wire | Nathaniel R. Quick, Aravinda Kar, Raymond R. McNeice | 2007-07-03 |