Issued Patents All Time
Showing 51–75 of 89 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777428 | Via interconnects in substrate packages | Srinivas V. Pietambaram | 2020-09-15 |
| 10741534 | Multi-die microelectronic device with integral heat spreader | Aleksandar Aleksov, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Robert Alan May, Srinivas V. Pietambaram | 2020-08-11 |
| 10705293 | Substrate integrated waveguide | Robert Alan May, Kristof Darmawikarta, Rahul Jain, Sri Ranga Sai Boyapati, Maroun D. Moussallem +1 more | 2020-07-07 |
| 10672695 | Multi-layer molded substrate with graded CTE | Srinivas V. Pietambaram | 2020-06-02 |
| 10658281 | Integrated circuit substrate and method of making | Kousik Ganesan, Marcel Wall, Srinivas V. Pietambaram | 2020-05-19 |
| 10477688 | Stretchable electronic assembly | Aleksandar Aleksov, Srinivas V. Pietambaram | 2019-11-12 |
| 10170428 | Cavity generation for embedded interconnect bridges utilizing temporary structures | Srinivas V. Pietambaram | 2019-01-01 |
| 10080290 | Stretchable embedded electronic package | Aleksandar Aleksov, Srinivas V. Pietambaram | 2018-09-18 |
| 10043740 | Package with passivated interconnects | Sri Ranga Sai Boyapati, Dilan Seneviratne, Srinivas V. Pietambaram, Kristof Darmawikarta, Robert Alan May +1 more | 2018-08-07 |
| 9931820 | Mold material for direct metallization | Srinivas V. Pietambaram | 2018-04-03 |
| 9716084 | Multichip integration with through silicon via (TSV) die embedded in package | Digvijay A. Raorane, Yonggang Li, Javier Soto Gonzalez | 2017-07-25 |
| 9458283 | Flexible underfill compositions for enhanced reliability | Dingying Xu, Nisha Ananthakrishnan, Hong Dong, Nachiket R. Raravikar, Gregory S. Constable | 2016-10-04 |
| 9397079 | Multichip integration with through silicon via (TSV) die embedded in package | Digvijay A. Raorane, Yonggang Li, Javier Soto Gonzalez | 2016-07-19 |
| 9312233 | Method of forming molded panel embedded die structure | Hamid Azimi, John S. Guzek | 2016-04-12 |
| 9165914 | Forming die backside coating structures with coreless packages | Mohit Mamodia, David Xu, Javier Soto Gonzalez, Edward R. Prack | 2015-10-20 |
| 9159649 | Microelectronic package and stacked microelectronic assembly and computing system containing same | Pramod Malatkar, Drew W. Delaney, Dilan Seneviratne | 2015-10-13 |
| 9068067 | Flexible underfill compositions for enhanced reliability | Dingying Xu, Nisha Ananthakrishnan, Hong Dong, Nachiket R. Raravikar, Gregory S. Constable | 2015-06-30 |
| 9000599 | Multichip integration with through silicon via (TSV) die embedded in package | Digvijay A. Raorane, Yonggang Li, Javier Soto Gonzalez | 2015-04-07 |
| 8703536 | In-situ foam material as integrated heat spreader (IHS) sealant | Paul R. Start | 2014-04-22 |
| 8569108 | Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die | Dingying Xu, Leonel Arana, Nachiket R. Raravikar, Mohit Mamodia, Rajasekaran Swaminathan | 2013-10-29 |
| 8508040 | In-situ foam materials as integrated heat spreader (IHS) sealant | Paul R. Start | 2013-08-13 |
| 8466559 | Forming die backside coating structures with coreless packages | Mohit Mamodia, Dingying Xu, Javier Soto Gonzalez, Edward R. Prack | 2013-06-18 |
| 8377550 | Flip chip package containing novel underfill materials | Rajasekaran Swaminathan, Hong Dong, Sandeep Razdan, Nisha Ananthakrisnan | 2013-02-19 |
| 8287996 | Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die | Dingying Xu, Leonel Arana, Nachiket R. Raravikar, Mohit Mamodia, Rajasekaran Swaminathan | 2012-10-16 |
| 8093105 | Method of fabricating a capillary-flow underfill compositions | Saikumar Jayaraman | 2012-01-10 |