Issued Patents All Time
Showing 76–89 of 89 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8009442 | Directing the flow of underfill materials using magnetic particles | Stephen Lehman, Leonel Arana, Wendy Chan | 2011-08-30 |
| 7948090 | Capillary-flow underfill compositions, packages containing same, and systems containing same | Saikumar Jayaraman | 2011-05-24 |
| 7816487 | Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same | Ravindra Tanikella | 2010-10-19 |
| 7718904 | Enhancing shock resistance in semiconductor packages | Sairam Agraharam | 2010-05-18 |
| 7535114 | Integrated circuit devices including compliant material under bond pads and methods of fabrication | Sairam Agraharam | 2009-05-19 |
| 7339276 | Underfilling process in a molded matrix array package using flow front modifying solder resist | Saravanan Krishnan, Choong Kooi Chee | 2008-03-04 |
| 7335973 | Adhesive of folder package | Karen Y. Paghasian, Shinobu Kourakata, Ruel D R Aranda | 2008-02-26 |
| 7224075 | Methods and systems for attaching die in stacked-die packages | Shinobu Kourakata, Nina Ricci Buenaseda | 2007-05-29 |
| 7202304 | Anhydride polymers for use as curing agents in epoxy resin-based underfill material | Saikumar Jayaraman | 2007-04-10 |
| 7151014 | Underfilling process in a molded matrix array package using flow front modifying solder resist | Saravanan Krishnan, Choong Kooi Chee | 2006-12-19 |
| 7041736 | Anhydride polymers for use as curing agents in epoxy resin-based underfill material | Saikumar Jayaraman | 2006-05-09 |
| 7033911 | Adhesive of folded package | Karen Y. Paghasian, Shinobu Kourakata, Ruel D R Aranda | 2006-04-25 |
| 6794225 | Surface treatment for microelectronic device substrate | Terry Sterrett, Tian-An Chen, Vassoudevane Lebonheur | 2004-09-21 |
| 6620512 | Anhydride polymers for use as curing agents in epoxy resin-based underfill material | Saikumar Jayaraman | 2003-09-16 |