Issued Patents All Time
Showing 26–50 of 89 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11769735 | Chiplet first architecture for die tiling applications | Srinivas V. Pietambaram, Gang Duan, Deepak Kulkarni, Xiaoying Guo | 2023-09-26 |
| 11756890 | Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications | Srinivas V. Pietambaram, Gang Duan | 2023-09-12 |
| 11694898 | Hybrid fine line spacing architecture for bump pitch scaling | Suddhasattwa Nad, Jeremy Ecton, Bai Nie, Marcel Wall | 2023-07-04 |
| 11664290 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more | 2023-05-30 |
| 11658055 | Customizable release layers to enable low warpage architectures for advanced packaging applications | Suddhasattwa Nad | 2023-05-23 |
| 11646274 | Multi-package assemblies having foam structures for warpage control | Mufei Yu, Gang Duan, Edvin Cetegen, Baris Bicen | 2023-05-09 |
| 11600563 | Molded embedded bridge including routing layers for enhanced EMIB applications | Srinivas V. Pietambaram | 2023-03-07 |
| 11527484 | Dielectric filler material in conductive material that functions as fiducial for an electronic device | Jesse C. Jones, Gang Duan, Jason M. Gamba, Yosuke Kanaoka, Vishal Shajan | 2022-12-13 |
| 11508676 | Density-graded adhesion layer for conductors | Kemal Aygun, Srinivas V. Pietambaram, Cemil Geyik | 2022-11-22 |
| 11501967 | Selective metal deposition by patterning direct electroless metal plating | Suddhasattwa Nad, Roy Dittler, Darko Grujicic, Marcel Wall | 2022-11-15 |
| 11445616 | Interfacial layer for high resolution lithography (HRL) and high speed input/output (IO or I/O) architectures | Suddhasattwa Nad, Marcel Wall | 2022-09-13 |
| 11380472 | High-permeability magnetic-dielectric film-based inductors | Srinivas V. Pietambaram, Kristof Darmawikarta | 2022-07-05 |
| 11355438 | Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications | Srinivas V. Pietambaram, Gang Duan | 2022-06-07 |
| 11291122 | Apparatus with a substrate provided with plasma treatment | Darko Grujicic, Rengarajan Shanmugam, Sandeep Gaan, Adrian BAYRAKTAROGLU, Roy Dittler +4 more | 2022-03-29 |
| 11276634 | High density package substrate formed with dielectric bi-layer | Srinivas V. Pietambaram, David Unruh, Frank Truong, Kyu Oh Lee, Junnan Zhao +1 more | 2022-03-15 |
| 11257748 | Semiconductor package having polymeric interlayer disposed between conductive elements and dielectric layer | Suddhasattwa Nad | 2022-02-22 |
| 11177234 | Package architecture with improved via drill process and method for forming such package | Suddhasattwa Nad, Marcel Wall | 2021-11-16 |
| 11177232 | Circuit device with monolayer bonding between surface structures | Suddhasattwa Nad, Marcel Wall | 2021-11-16 |
| 11164818 | Inorganic-based embedded-die layers for modular semiconductive devices | Srinivas V. Pietambaram, Tarek A. Ibrahim, Kristof Darmawikarta, Debendra Mallik, Robert L. Sankman | 2021-11-02 |
| 11158558 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more | 2021-10-26 |
| 11107781 | RFIC having coaxial interconnect and molded layer | Srinivas V. Pietambaram, Kristof Darmawikarta, Robert Alan May, Aleksandar Aleksov, Telesphor Kamgaing | 2021-08-31 |
| 11081448 | Embedded die microelectronic device with molded component | Srinivas V. Pietambaram, Praneeth Akkinepally, Jesse C. Jones, Yosuke Kanaoka, Dilan Seneviratne | 2021-08-03 |
| 11062933 | Die placement and coupling apparatus | Jesse C. Jones, Gang Duan, Yosuke Kanaoka | 2021-07-13 |
| 10892219 | Molded embedded bridge for enhanced EMIB applications | Srinivas V. Pietambaram | 2021-01-12 |
| 10847471 | Dielectric filler material in conductive material that functions as fiducial for an electronic device | Jesse C. Jones, Gang Duan, Jason M. Gamba, Yosuke Kanaoka, Vishal Shajan | 2020-11-24 |